Changsha AMQ Intelligent Technology Co.. Ltd-Flip Chip (FC)-SIP-Weld packaging (WB)

Leading the trend of surpassing Moore's packaging

Supporting independent manufacturing of core chips

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引领超越摩尔封装潮流

支撑核心芯片自主制造

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About Us

Dedicated to the R&D and manufacturing of high-end custom chip packaging industry, we provide a turnkey solution for chipmakers and brands at the forefront of technology.

National Specialized and New
National High-tech Enterprise, National Specialized and New "Small Giant" Enterprise
Undertaking unit of major scientific and technological projects in Hunan Province and Changsha City

Established in 2017

2017 Year

80+ Patents

80 +

230+ Employees

230 +

Innovative technology 60 %+

60 %+

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Packaging Services

Unique specialty in large-sise and multi-chip FC packaging, and high-power density SiP packaging

Products applications in various fields such as high-end servers, Artificial Intelligence (AI) ,5G communication devices, mobile terminals, wearbles, automobile and more.

Flip Chip (FC)

Flip Chip (FC) Large Chip

Flip Chip (FC) High Computing Power

Flip Chip (FC) High Frequency

Flip Chip (FC) High Density

SIP

SIP encapsulation Multi-chip

SIP encapsulation Multi-layer

SIP encapsulation High power

SIP encapsulation High reliability

Weld packaging (WB)

Wire Bonding (WB) Full Line Type

Wire Bonding (WB) Thin Chip

Wire Bonding (WB) Small Solder Ball

<img alt=" Flip Chip (FC) " src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8e693354-506a-4bc7-9d89-f579bc01c6b0.png" style="max-width: 100%;"/> Large Chip <img alt=" Flip Chip (FC) " src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/bb2a3422-92c5-4b44-9d14-75cb3fb72fbe.png" style="max-width: 100%;"/> High Computing Power <img alt=" Flip Chip (FC) " src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/64880b9c-88a3-4ddf-9972-7475e363fc7d.png" style="max-width: 100%;"/> High Frequency <img alt=" Flip Chip (FC) " src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/290f9034-aa87-4b8f-828f-afb663b4d550.png" style="max-width: 100%;"/> High Density

<img alt=" SIP encapsulation " src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/db9b94d7-a79e-4ef1-af6f-6b981fdb0533.png" style="max-width: 100%;"/> Multi-chip <img alt=" SIP encapsulation " src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/8b9169da-3c5d-4abf-861f-24b0b2bcc3fb.png" style="max-width: 100%;"/> Multi-layer <img alt=" SIP encapsulation " src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a922becb-8968-49aa-8d2d-5bb6e45e2e4e.png" style="max-width: 100%;"/> High power <img alt=" SIP encapsulation " src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/f8a3c974-71dd-4ba4-a7f1-311b558299eb.png" style="max-width: 100%;"/> High reliability

<img alt=" Wire Bonding (WB) " src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/a6041664-a176-4684-b3e5-6f7237813db4.png" style="max-width: 100%;"/> Full Line Type <img alt=" Wire Bonding (WB) " src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/b4034623-d811-476f-8e5b-b1976be3b878.png" style="max-width: 100%;"/> Thin Chip <img alt=" Wire Bonding (WB) " src="https://omo-oss-image.thefastimg.com/portal-saas/pg2024090411001046139/cms/image/74388171-157e-41df-be2a-558385d7cd3c.png" style="max-width: 100%;"/> Small Solder Ball

Packaging Technology

3D-SiP, FC-SiP and client-collaborative design and simulation for reliability maximisation.

IndiumPk™

AMQ is proud to be the pioneering OSAT provider to adapt Indium as a core packaging material, leading a new chapter in electronic device reliability and performance.

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Packaging design and simulation

AMQ's design team possesses extensive design and simulation experience in the electronics market, covering mobile, network, computer, consumer, and automotive products.

This encompasses laminate, wire-bonded, flip-chip, and system-in-package designs, including single-mode, multi-mode, package-on-package (PoP), integrated passive devices (IPD), and advanced three-dimensional system-in-package (SiP) technologies.

Through close collaboration with clients, we strive to deliver optimal products in terms of performance, quality, lead time, and cost, assisting clients in determining the best packaging solutions for their products.

The design and simulation team works closely with clients, employing collaborative design to ensure that semiconductor packaging meets thermal and electrical performance requirements.

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Large and multi-chip specialty

AMQ stands as China’s industry leader in large-scale and multi-chip packaging innovation, being the first domestic OSAT provider to successfully create the largest chip package and to pioneer the “first four-chip integrated package” in China. These achievements firmly establish AMQ’s technical prowess and superiority in the field.

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News

Focus on AMQ, understand industry information dynamics

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Company News

AMQ assists in the establishment of the world's first RDSA industry alliance

On September 20, the RDSA Industrial Alliance, the world's first industry innovation cooperation organisation based on RISC-V (fifth-generation reduced instruction set open-source architecture) DSA (domain-specific architecture), was officially established in Zhuhai. It will create a co-creation and sharing RISC-V, DSA international open innovation platform.

2024-09-23

Company News

Announcement: AMQ on list of Hunan Province's Intelligent Manufacturing Benchmark companies

Recently, the Hunan Provincial Department of Industry and Information Technology organised the 2024 Hunan Provincial Intelligent Manufacturing Benchmark Enterprises and Benchmark Workshops application and certification work. After enterprise application, recommendation by municipal and prefectural industrial and information technology bureaus, comprehensive review, expert review, and research by the Department's Party group, Changsha AMQ Intelligent Technology Co., Ltd.'s [Advanced Packaging Intelligent Manufacturing Workshop for Chips] won the title of Hunan Provincial Intelligent Manufacturing Benchmark Workshop (No. 19).

2024-08-16

Company News

The AMQ Advanced Packaging Base is officially launched, continuously promoting the construction of a high-power, high-computing power, high-end chip industry ecosystem.

On June 13th, the "2024 Changsha Joint Construction of a New Generation of Semiconductor Industry Ecosystem Conference and Industry Chain Special Theme Activities," hosted by the Xiangjiang New Area Management Committee and jointly organised by AMQ, was successfully held at the AMQ Advanced Packaging Base. Nearly 200 guests witnessed the official launch of the AMQ Advanced Packaging Base.

2024-06-18

Company News

Zhang Pingwen, President of Wuhan University and a member of the Chinese Academy of Sciences, and his delegation visited AMQ for guidance and exchange.

Recently, Professor Zhang Pingwen, President and Vice Secretary of the Party Committee of Wuhan University, and a member of the Chinese Academy of Sciences, along with Professor Liu Sheng, a member of the Chinese Academy of Sciences, Executive Dean of Wuhan University's Institute of Industrial Science, Dean of the School of Power and Machinery, and Vice Dean of the School of Microelectronics, visited Jin'an Muquan for an inspection, accompanied by leaders from the Changsha Municipal People's Government, the Municipal Science and Technology Bureau, and relevant experts.

2024-02-22

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