Establishment time
Intellectual property rights
Number of employees
Changsha AMQ Intelligent Technology Co., Ltd.
AMQ was established in Hunan in 2019 and founded by Dr. Zhu Wenhui, a Singapore nationale, specially-appointed expert in China, the chief scientist of China’s "973 Plan", Professor at Shongnan University, and a foreign academician of the Russian Academy of Natural Sciences.
AMQ is the only national-level high-tech enterprise in China leading the high-end chip packaging sector, specialising in the most advanced flip-chip system-in-package technology (FC-SiP). Solving challenges of high-end large chips such as CPUs, GPUs, DSPs, AIs, and FPGAs, we have broken norms as a relatively new entrant with successful track record of mass-produced large chip packaging.
We are honoured to be embedded in strategic partnerships spanning the industry, including leading CPU, FPGA and GPU enterprises at the frontier, to propel rapid product development and breakthroughs with shared vision and commitment towards the new tech future.
In China, AMQ has organically built a solid reputation with winning honors such as National High-tech Enterprise, National-level Specialised and New "Little Giant" Enterprise, Hunan Provincial Specialised and New Small and Medium-sised Enterprise, Hunan Provincial Digital New Infrastructure 100 Landmark Project Enterprise, and Changsha Municipal Intelligent Manufacturing Demonstration Enterprise. It is a Hunan Provincial New R&D Institution, a Changsha Municipal Next-Generation Artificial Intelligence Open Innovation Platform, and an undertaking unit of a major Changsha Municipal science and technology project, filling the gap in the advanced packaging field of the integrated circuit industry chain in China.
Establishment time
Patent authorization
Number of employees
Innovative technology
Founder
Dr. Zhu Wenhui
National Key Talent Program Expert, Academician of the Russian Academy of Natural Sciences
2010 : Invited to join a listed T packaging company, serving as CTO/ CEO/ Dean of the Research Institute
Won the first prise of the National Overseas Chinese Contribution Award (2018)
Completed a major national science and technology project (2011-2014), with excellent evaluation
Established the first advanced packaging research institute in China (2011)
Established an advanced packaging characterisation laboratory (2006-2008)
Chief scientist of the National Basic Research Program of China (973 Program), the only packaging project, won the Ministry of Science and Technology's excellent award, and made multiple technological breakthroughs in 3D chip integration
Expert of the overall group of the National Major Science and Technology Project 02
Consulting expert of China Semiconductor Packaging and Testing Industry Technology Innovation Strategic Alliance
Director of the Expert Committee of Hunan Province/Changsha City Integrated Circuit Design and Application Industry Alliance
Founder and director of Huajin Semiconductor
Global layout
Rooted in Asia, servicing clients internationally
Honors & Qualifications
National High-tech Enterprise
National specialized and new
Quality Management System Certification
Laboratory Accreditation Certificate
Honors and Qualifications
National High-tech Enterprise
