Weld packaging (WB)-Encapsulated service-Changsha AMQ Intelligent Technology Co.. Ltd

Encapsulated Products National high-tech enterprise focusing on high-end chip packaging

Flip Chip (FC)

SIP

Weld packaging (WB)

Wire bonding: 0.6-2.0mil (gold, silver, copper, alloy wires)

Ball sise: >=0.25mm

Die thickness: >=75um

Product yield: >99.9%

Design Drawing

FBGA-stacked die packaging

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