Job requirements

Job Responsibilities:

1. Actively develop new markets, cultivate new clients, and expand the customer base;

2. Achieve the team's quarterly and annual sales targets according to the department's requirements;

3. Maintain customer relationships and consolidate long-term cooperation plans with clients;

4. Responsible for collecting and providing feedback on market information and competitor situations in the assigned region.

Job Requirements:

1. More than 3 years of sales experience in packaging plants or sales agency experience of semiconductor products and chips;

2. Familiar with the high-end semiconductor packaging and testing customer groups and their representative products, and familiar with market dynamics;

3. Proactive, passionate, strong communication skills, and excellent business development and maintenance capabilities.

Job Responsibilities:

1. Responsible for the introduction of new encapsulation products and the production of engineering batches, including FC products, WB products, Hybrid products, stacked chip products, and exposed chip products;

2. Responsible for handling quality issues and optimizing parameters during the Molding production process;

3. Responsible for formulating and implementing product production processes and standards, preparing operation manuals, organizing continuous optimization of product processes, process parameters, and material applications, formulating and modifying product material consumption quotas, providing production lines with equipment, materials, methods, tools, and engineering training services, and promoting the standardization of engineering;

4. Tracking and implementing the introduction of new equipment and processes and major improvement plans, and formulating operational specifications;

5. Writing documents, records, and reports on equipment operation, maintenance, inspection, and calibration;

6. Supervising the implementation of management methods for tooling and KIT in this process;

7. According to product processing technical drawings, creating procedures and, according to statistical data, analyzing the causes of product defects and improvement methods;

8. Installation, acceptance, data recovery, and follow-up coordination and resolution of remaining issues for equipment, molds, and some auxiliary facilities;

9. Responsible for analyzing defective products reported by customers and providing analysis and improvement reports to customers;

10. Optimization of encapsulation mold design and continuous improvement of process capabilities.

Job Requirements:

1. Junior college or above, majoring in microelectronics, integrated circuits, electronics, mechanics, automation, or related fields;

2. Familiar with Molding processes, with experience in mold design improvement, product design, and compound selection;

3. More than 8 years of experience in the same position, proficient in office software and data statistical analysis;

4. Possessing good communication skills, strong coordination abilities, and team spirit;

5. Familiar with the principles of equipment operation and fault analysis, those proficient in TOWA/FICO and other Transfer Mold equipment are preferred;

6. Able to independently disassemble and assemble encapsulation molds;

7. Proficient in operating SAT and able to accurately judge abnormalities and defects

Job Responsibilities:

1. Responsible for operating automated equipment, loading and unloading materials (cleanroom environment).

2. All positions involve operating automated equipment, no manual work required, allowing you to say goodbye to assembly lines and traditional manual labor coils;

Job Requirements:

Aged 18-40, junior high school education or above, obedient to work arrangements, serious and responsible at work, able to accept wearing cleanroom suits, and able to accept two shifts.

Job Responsibilities:

1. Responsible for packaging selection, feasibility assessment, and project planning during the early stages of new product introduction;

2. Responsible for preparing materials and fixtures required for new product introduction;

3. Lead trial production arrangements and project plan tracking for new products during engineering, qualification, and small-batch production stages;

4. Responsible for client communication during new product introduction, coordinating and addressing customer needs and quality issues reported during the trial production phase;

5. Responsible for summary reports for all stages of new product introduction, etc.

Job Requirements:

1. Over 3 years of experience in the semiconductor packaging industry, and over 2 years of experience in new product introduction; familiar with semiconductor packaging processes;

2. Familiar with FlipChip and FBGA packaging material selection and various risk assessments; familiar with various reliability requirements;

3. College degree or above;

4. Strong analytical and learning abilities, strong sense of responsibility, and good teamwork skills.

Job Responsibilities:

1. Responsible for the introduction of new products, development of new processes, and verification of new materials related to the FCA process;

2. Responsible for handling quality issues and parameter optimization during the die-attach process;

3. Responsible for the formulation and implementation of product production processes and standards, preparation of operation manuals, organization of continuous optimization of product processes, process parameters, and material applications, formulation and modification of material consumption quotas for products, provision of equipment, materials, methods, tools, and engineering training services for production lines, and promotion of engineering standardization;

4. Tracking and execution of new equipment and new process introduction and major improvement plans, and formulation of operation specifications;

5. According to product processing technical drawings, create procedures and, based on statistical data, analyze the causes of product defects and improvement methods;

6. Responsible for analyzing defective products reported by customers and providing analysis and improvement reports to customers;

Job Requirements:

1. Junior college or above, majoring in microelectronics, integrated circuits, electronics, mechanics, automation, or related fields;

2. More than 3 years of experience in FCA processes, proficient in office software and data statistical analysis;

3. Possesses good communication skills, strong coordination abilities, and team spirit;

4. Familiar with the principles, operation, and fault analysis of equipment, proficient in DATACON8800 series, those proficient in TCB thermocompression bonding and 2.5D packaging are preferred;

Job Responsibilities:

1. Responsible for handling equipment malfunctions during production, equipment fault diagnosis and repair, tracking repair effectiveness, and issuing repair reports.

2. Organize and summarize equipment failure types and frequencies to improve OEE/COEE, and provide corresponding preventive improvement measures.

3. Handle production line quality abnormalities, provide improvement and preventive measures, and generate reports in a specific format.

4. Train technicians and assistant engineers to meet the required technical standards.

5. Develop new equipment technical agreements and conduct overall equipment relocation buy-offs.

6. Review tool-related drawings, establish corresponding buy-off processes and standards.

7. Collaborate with other departments to improve production difficulties on the production line, and develop corresponding improvement measures and plans.

8. Develop equipment maintenance documents and guide maintenance work.

9. Collaborate with the department and other departments to achieve the company's objectives and other requirements.

Job Requirements:

1. Junior college or above, science and engineering related.

2. Proficient in using office tools such as PPT, EXCEL, WORD, and CAD.

3. Able to wear cleanroom suits and cooperate with company overtime.

4. Experience in semiconductor packaging FCBGA & FCCSP, familiar with electrical circuits, proficient in the operation and maintenance of various models of equipment such as Besi DATACON 8800, BTU reflow oven, and KED washing machine.

5. Outgoing personality and strong ability to withstand pressure.

6. Timely cooperation to complete various tasks assigned by superiors