Microchip Manufacturing


Leading Design and Simulation Capabilities

We have a top-tier design and simulation team, experienced and specialised in power integrity optimisation and sign-off for high-power, large-sise, high-performance packaging. They possess leading customer chip co-design capabilities and have served clients such as Intel, AMD, Xilinx, Altera, Infineon, Huawei, Qualcomm, and Broadcom.

Virtual Manufacturing