Large and multi-chip specialty
Technical Innovation and Milestones
- Largest Chip Package Technology
AMQ was the first to realize the largest-scale chip package in China, overcoming major challenges in wafer handling, soldering, thermal management, and system integration. Sophisticated 3D-SiP and FC-SiP design and simulation capabilities enabled breakthroughs in heat dissipation, mechanical stress control, and multi-chip interconnection, setting new industry standards for high-power density and reliability.
- China’s First Four-Chip Integrated Package
AMQ pioneered the process for four-chip parallel integration, delivering full innovation from design to mass production. Through co-design, failure analysis, and reliability optimization, AMQ achieved heterogeneous multi-chip integration, boosting system functionality and integration for advanced applications such as AI, high-performance computing, and servers.
Technical Advantages and Industry Leadership
- Broad packaging capabilities: Offering stacked, multi-mode, system-in-package (SiP), and IPD packages to meet requirements of mobile devices, automotive electronics, advanced computing, and more.
- R&D-driven innovation: AMQ collaborates with clients on co-design, heat management, and structural optimization to solve large-scale and multi-chip packaging challenges.
- Rigorous reliability validation: In-house test and failure analysis labs conduct comprehensive thermal, humidity, and environmental trials to ensure product life and stability.
Delivering Client Excellence
Through global vision and local innovation, AMQ continues to drive the advancement of chip packaging technologies, providing leading large-scale and multi-chip integration solutions. Whether for high-performance product customization or complex system integration, AMQ’s committed excellence in process and quality makes it the industry’s partner of choice.
AMQ—The leader in large and multi-chip packaging technology in China, continually redefining the standards of semiconductor packaging innovation.
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