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30
2026
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Packaging design and simulation
- With extensive design and simulation experience in the electronics market, encompassing mobile, network, computer, consumer, and automotive products, our expertise encompasses a wide range of services from laminate, wire-bonded, flip-chip, and system-in-package designs, including single-mode, multi-mode, package-on-package (PoP), integrated passive devices (IPD), and advanced three-dimensional system-in-package (SiP) technologies.
- Through close collaboration with our clients from the design stage, we have set records in delivering optimal products exceeding client expectations in performance, quality, lead time, service and cost, as well as dynamic product development in exploring the best packaging solutions for new product challenges.
- The design and simulation team works closely with clients, employing co-design to ensure that semiconductor packaging meets all round thermal and electrical performance requirements.
Structural Design
Physical Attributes |
Chip-to-Package |
Package-to-Board |
Mechanical Simulation
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Electrical Simulation
Thermal Simulation
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