IndiumPk™
Innovation that Sets AMQ Apart
Faced with the challenges of thermal management, mechanical deformation, and structural delamination in high-end chip packaging, AMQ set out to solve what others deemed unsolvable. Traditional solutions fell short as device power and integration rose. Through deep simulation, empirical testing, and proprietary process control, AMQ engineers identified indium’s unique thermal, electrical, and mechanical properties as pivotal—innovating a package design that delivers outstanding heat dissipation, flexibility, and coverage.
- Material Breakthrough: Indium’s high ductility and thermal conductivity enable AMQ packages to outperform conventional methods, minimizing interface stress and maximizing lifetime yield.
- Proven Reliability: AMQ’s workflow allows precise simulation and in-process validation of indium sealing, ensuring measured warpage and mechanical properties meet strict operational standards.
- Industry Leadership: This forward-thinking approach distinguishes AMQ from competitors using legacy processes. As a result, AMQ consistently sets benchmarks in device endurance, low defect rates, and robust yields for AI, computing, and mission-critical electronics.
Leading the way for Clients
AMQ’s commitment to visionary engineering, discipline, and continuous R&D positions it as the industry’s innovation authority. Clients working with AMQ access unparalleled advanced packaging expertise, tailored reliability, and high-performance integration rarely available elsewhere in the industry. AMQ’s indium-based process is validated by strong experimental and simulation consistency, ensuring that each package delivers tangible, maximum-value results.
You set the standards, we meet them.
By making bold material choices and investing in technologically advanced workflows, AMQ ensures that every project benefits from unmatched innovation, proven performance, and enduring reliability—defining what’s possible in semiconductor packaging.
Our innovation and R&D efforts are closely aligned with clients’ needs and industry progress to push boundaries and create real differentiation and competitive edge in this fast moving tech age.
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