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2023
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AMQ successfully completed a Series C financing round of over 400 million yuan.
Recently, Changsha AMQ Intelligent Technology Co., Ltd. (hereinafter referred to as "AMQ" or "the Company") successfully completed a Series C financing round exceeding 400 million yuan. This round of financing was led by Xiangjiang Guotou and Huajin Capital, with Lenovo Ventures participating, and followed by Shenzhen Investment Holdings Capital, Changjiang Capital, Shenzhen Smart City Industrial Investment, Oriental Fortune Capital, and Suzhou Qianrong Capital.
This round of financing further brings together various forces, including industrial investment institutions, local funds, and well-known financial investment institutions. It will help AMQ continue to leverage its strengths, build core competitiveness with leading technology, and accelerate its seizure of the high-end chip advanced packaging market.
AMQ Phase I Base
AMQ is the only local national high-tech enterprise and national specialized and new "small giant" enterprise focusing on advanced packaging and testing services for high-end chips. It was founded by Dr. Zhu Wenhui, a national key talent program expert, the chief scientist of the only packaging project under the "973" plan, and a foreign academician of the Russian Academy of Natural Sciences.
The company focuses on system-in-package (FC-SiP) technology centered on flip-chip, solving the problem of independent manufacturing of key domestic high-end chips such as CPUs, GPUs, FPGAs, ASICs, and ADCs. It has received widespread recognition from leading companies in these sub-sectors, and its business has grown exponentially in recent years.
AMQ High-End Large Chip Packaging Products
The funds raised in this round of financing will be mainly used for the expansion construction of the company's 30,000-square-meter Phase II base, as well as research and development innovation in advanced packaging technology, to better meet the growing needs of domestic high-end chip customers. The company plans to grow into a leading enterprise and industry benchmark in advanced packaging of domestic high-end chips such as CPUs/GPUs within 5-10 years, further promoting the domestication process of advanced packaging for China's high-end chips.
AMQ Phase II Expansion Project is about to be put into production
