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2024
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01
AMQ Company has made significant progress in the application of indium foil technology.
With the global popularity of generative AI large models represented by ChatGPT, high-end chips such as CPUs, GPUs, and DPUs used in servers and AI fields are developing towards high computing power, resulting in high power consumption and demanding heat dissipation requirements. However, the thermal interface materials (TIMs) commonly used in actual chip packaging have low thermal conductivity (4~6W/mK), which to some extent restricts industrial development.
In the field of high-end chip packaging, the thermal conductivity and physical properties of indium (Indium) make its heat dissipation performance significantly better than other metal materials. Its thermal conductivity can reach 86W/mK, which can significantly reduce packaging thermal resistance and improve product performance. It has important application prospects in HPC products.
After a year of technological breakthroughs, AMQ's project team has made significant progress in the application of indium foil technology in high-end chip flip-chip packaging. Facing a series of process and reliability challenges such as high welding void rate, indium overflow/sputtering, and warping-induced interfacial cracking, the team has solved problems such as the "power wall" of high-end chips in high-computing scenarios through continuous upgrades to structural layout design, parameter process optimization, and control of technical materials.
FC-LGA
▲After vacuum reflow, indium foil void rate <1% (left), coverage >96% (right)
FC-BGA
▲After multiple reflows, indium foil void rate <5% (left), coverage >95% (right)
Currently, AMQ has the FC-LGA indium foil packaging capability and has achieved small-batch sample production. For large-size chip FC-LGA products, the void rate after indium foil welding is <1%, and the coverage is >96%; the indium foil used in FC-BGA has a void rate of <5% and a coverage of >95% after multiple reflows. In 2024, AMQ's FC-BGA and MCM FC-LGA indium foil packaging technology is expected to achieve stable mass production.
