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2024
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Looking back at 2023, we've journeyed together
Looking back at 2023, it was a year full of challenges but also opportunities. Issues such as inventory destocking and fragmented industry chains in the semiconductor industry presented severe challenges to domestic substitution; at the same time, market demand for new energy, artificial intelligence, and high-end chips grew rapidly, intensifying competition. This year, AMQ people acted pragmatically, with the support of the provincial, municipal, and Xiangjiang New Area governments, and in collaboration with shareholders, customers, and the supply chain, forging ahead. The company's operations achieved a breakthrough against the trend, yielding fruitful results and achieving overall leapfrog development.
Technological Leadership Further Enhances Core Competitiveness
As one of the pioneers in the domestic high-end packaging and testing field, AMQ has always adhered to technological leadership.
In 2023, AMQ successfully delivered China's first large-size GPU package for Chiplet technology, and the most complex SiP module products (≥200 components) entered mass production;
At the same time, breakthrough progress has been made in the research and development of multi-chip series CPU products represented by the largest domestic sise (greater than 100*100mm²). Advanced indium-based FCBGA technology, larger than the industry's mass production sise, has entered the application stage, marking that large-sise chip In TIM FCBGA packaging technology is at the forefront of the industry.
Forging Ahead, Market Performance Continues to Grow
Against the backdrop of a sluggish overall semiconductor market, in 2023, the company's sales revenue increased significantly against the trend, and the number of customers and the number of new product types introduced reached a new level. Through continuous cultivation, AMQ has established a brand image in the fields of large-sise FCBGA and high-power power management, and its industry influence in advanced packaging and testing continues to expand.
Successful Financing Accelerates Advanced Packaging Layout
At the beginning of the year, Loongson Zhongke strategically invested in AMQ, marking the beginning of a comprehensive strategic partnership between the two parties; in October, AMQ successfully completed a Series C financing round exceeding 400 million yuan, led by Xiangjiang Guotou and Huajin Capital, with Lenovo Ventures participating. The joint recognition and strong support from national-level investment institutions, provincial and municipal state-owned capital platforms, and leading industrial investment institutions have helped AMQ accelerate its efforts to seize the commanding heights of advanced packaging for high-end chips.
Expansion Completion Significantly Increases Production Capacity
In August 2023, AMQ's advanced packaging and testing expansion project for high-end chips was officially completed. It will be officially put into operation in the first quarter of 2024, with an estimated annual production capacity increase to 200 million FC (flip-chip) chips, 300 million SIP chips, and 120 million chip tests. The expansion will greatly promote the domestic substitution process of advanced packaging for high-end chips.
Intelligent Upgrades and Continuous Improvement of the Quality System
While expanding its layout, increasing production capacity, and strengthening production control, AMQ also pays attention to the construction of the company's soft power.
In 2023, the company completed certifications for its information security system, CNAS platform for reliability services, and other certifications, providing more effective guarantees for production quality control.
The upgrade of the intelligent information system has been fully launched, and systems such as MES and ERP will be officially launched in January 2024.
Specialised, Refined, and Unique Honors Crowned, Inspiring Innovation
Based on its deep cultivation and continuous innovation in the field of advanced packaging, in 2023, AMQ successively won the National Specialised, Refined, and Unique Small and Medium-sised Enterprise recognition and Hunan Provincial Specialised, Refined, and Unique Small and Medium-sised Enterprise recognition; it was approved as the Hunan Provincial Engineering Technology Research and Development Center and the Changsha Municipal Next-Generation Artificial Intelligence Open Innovation Platform; it successfully applied to become an undertaking unit for national advanced manufacturing industry cluster key projects, Hunan Provincial key research and development plan projects, and Hunan Provincial & Changsha Municipal project undertaking units. The company's innovation capabilities and R&D strength in the field of advanced packaging have been fully affirmed.
Party Building Leadership, Unity and Strength, Jointly Creating Brilliance
AMQ attaches importance to party, trade union, and group construction, implementing the principle of "being contributor-oriented", uniting and concentrating efforts.
The Party branch uses "Party building + culture" as a lever to strengthen the ideological and political education of Party members and the masses, regularly organising employees to study Xi Jinping's Thought on Socialism with Chinese Characteristics for a New Era and the spirit of the 20th National Congress of the Communist Party of China, and regularly conducting Party member Party spirit education, employee skills training, departmental professional training, and on-the-job operation training.
The trade union carefully organises employee birthday parties, visits to red cultural bases, and other corporate culture-building activities to promote employee quality improvement and further enhance the centripetal force and cohesion of all AMQ people.
Looking back at 2023,
There were hardships and challenges;
There was sweat and joy.
Hardships tempered our will;
Successes built our confidence.
Looking forward to 2024,
We will work together to set out and bravely climb the peak!
