18
2024
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06
The AMQ Advanced Packaging Base is officially launched, continuously promoting the construction of a high-power, high-computing power, high-end chip industry ecosystem.
On June 13th, the "2024 Changsha Joint Construction of a New Generation of Semiconductor Industry Ecosystem Conference and Industry Chain Special Theme Activities," hosted by the Xiangjiang New Area Management Committee and jointly organised by AMQ, was successfully held at the AMQ Advanced Packaging Base. Nearly 200 guests witnessed the official launch of the AMQ Advanced Packaging Base.
Tan Yong, Deputy Secretary of the Changsha Municipal Committee, Secretary of the Party Working Committee of Hunan Xiangjiang New Area (Changsha High-tech Sone), and Secretary of the Yuehu District Committee; Sou Te, Standing Committee Member of the Changsha Municipal Committee and Secretary-General of the Municipal Committee; Peng Tao, Member of the Party and Government Group and Deputy Mayor of the Changsha Municipal People's Government; Tu Wenqing, Deputy Secretary-General of the Changsha Municipal Committee; Guo Sijun, Party Secretary and Director of the Changsha Municipal Bureau of Industry and Information Technology; Xiao Yongjun, Party Secretary of Changsha Information Industry Park; and many leaders from relevant municipal and district departments and the semiconductor industry chain attended the event.
▲Secretary Tan Yong announced the opening of the 2024 Changsha Joint Construction of a New Generation of Semiconductor Industry Ecosystem Conference and the launch of the AMQ Advanced Packaging Base.
▲Deputy Mayor Peng Tao delivered a speech at the conference, introducing the construction of Changsha's new generation of semiconductor industry, and stating that the convening of this industry ecosystem conference and the launch of the AMQ new base are of great strategic significance for promoting the construction of a high-power, high-computing power, high-end chip industry ecosystem in Changsha and even the whole country.
▲Dr. Zhu Wenhui, chairman of Changsha AMQ Intelligent Technology Co., Ltd., and expert of the National Major Science and Technology Project 02 expert group, introduced the AMQ Advanced Packaging Base to the guests, stating that in the future, 3 to 5 billion yuan will continue to be invested to contribute to the advanced packaging of large chips such as CPUs, GPUs, and artificial intelligence in China.
This event attracted many industry leaders, including Yu Xiekang, Executive Vice President of the Integrated Circuit Branch of the China Semiconductor Industry Association and Vice President of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Alliance; Zhang Wei, Dean and Vice Secretary of the Party Committee of the School of Microelectronics, Fudan University; Zhang Guoming, Secretary-General of the China Integrated Circuit Equipment Alliance and General Manager of Huahai Qingke Co., Ltd.; Cao Liqiang, Deputy Director of the Institute of Microelectronics, Chinese Academy of Sciences; Chen Jie, Joint President of Tsinghua Unigroup Co., Ltd. and National Specially Appointed Expert; Qiu Xingya, Chairman and General Manager of Unimicron Technology; Zhang Jianzhong, founder and CEO of Moore Threads; and Zhang Ge, director and vice president of Loongson Zhongke Technology Co., Ltd., as well as representatives from national integrated circuit industry enterprises, supply chain enterprises, and financial investment institutions.
▲Ye Tianchun, academician of the International Eurasian Academy of Sciences, technical chief expert of the National Major Science and Technology Project 02 expert group, chairman of the Integrated Circuit Branch of the China Semiconductor Industry Association, and secretary-general of the China Integrated Circuit Innovation Alliance, sent congratulations to AMQ and stated that in the face of new challenges, all integrated circuit professionals have a mission to shoulder, calling for joint efforts across the entire industry chain to create new high-quality productivity for the integrated circuit industry.
▲Yu Xiekang, Executive Vice President of the Integrated Circuit Branch of the China Semiconductor Industry Association and Vice President of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Alliance, delivered a speech, analyzing the severe international situation facing the semiconductor industry, and hoping that AMQ will take the lead in advanced packaging technology research and development and innovation to make positive contributions to promoting the domestic process of advanced packaging technology for high-end chips in China.
▲Joint Construction of a High-end Chip Industry Ecosystem Initiative and Signing Ceremony.
At the event, Changsha AMQ Intelligent Technology Co., Ltd., together with 10 companies including Loongson Zhongke Technology Co., Ltd., Moore Threads Intelligent Technology (Beijing) Co., Ltd., Changsha Jingjia Microelectronics Co., Ltd., and Hunan Xiangjiang New Area State-owned Capital Investment Co., Ltd., jointly initiated a letter of intent to jointly build a high-end chip industry ecosystem.
Integrated circuit industry chain upstream and downstream enterprises strengthen industrial collaboration, increase R&D investment and innovation efforts, achieve resource sharing and complementary advantages, create an industrial ecosystem with strong competitiveness and innovation, and contribute to the high-quality development of China's semiconductor industry.
▲Cao Liqiang, deputy director of the Institute of Microelectronics, Chinese Academy of Sciences, delivered a keynote report on "Opportunities and Collaborative Innovation in Advanced Packaging," stating that innovation in advanced packaging technology is an important way to break through the development bottleneck of large-computing power chips, and accelerating the verification and industrialisation of domestic packaging materials and equipment is crucial.
▲Zhang Ge, director and vice president of Loongson Zhongke, delivered a keynote report on "Jointly Building an Independent Core System and Creating New High-Quality Productivity," introducing Loongson CPU core products and in-depth cooperation with AMQ, and stating that it will work with AMQ and other upstream and downstream enterprises to build a secure and controllable high-end supply chain system and build an independent information industry ecosystem.
AMQ landed in Hunan Xiangjiang New Area in 2019, focusing on solving the problem of independent packaging of high-end large chips such as CPUs, GPUs, FPGAs, and AI. It has continuously innovated in the field of high-end chip flip-chip system-in-package (FC-SiP), and has won the trust and recognition of a large number of customers with its high-quality technology and services. Its revenue has been setting new highs year after year, and the specifications and complexity of its packaging products have been continuously increasing, with the largest packaging sise reaching 102*102mm². It has created many industry firsts in the fields of domestic CPUs, GPUs, AI, and high-power power modules.
The launch of this advanced packaging base is also a new starting point for the future development of AMQ. Looking to the future, we will continue to adhere to the core values of "customer-centric and talent-based," further increase investment, promote the establishment of an advanced packaging research institute, strengthen cooperation with upstream and downstream enterprises, and contribute to the construction of a high-power, high-computing power, high-end chip industry ecosystem. We aim to become a leading enterprise in advanced packaging of large chips such as CPUs, GPUs, and AI, helping Changsha become a domestic high-end large chip advanced packaging center, strongly supporting the development of digital industries such as artificial intelligence, data centers, and intelligent transportation in our province, helping to build a new generation of independent and secure computing system industry clusters, and contributing to Hunan Province's achievement of the "Three Highs and Four News" new goals and the creation of a "Processor Capital".
